Dissemination

Journal publications, conference proceedings and articles

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Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior Mike Feuchter; Hanna Baumgartl; Martin Hanke; Sven Rzepka; Bernhard Wunderle CADFEM Germany GmbH, Fraunhofer ENAS, Technische Universität Chemnitz 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 09 April 2024 Link to Paper
CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design Baris Erol; Daniel May; Bernhard Wunderle; Technische Universität Chemnitz 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 09 April 2024 Link to Paper

 

Public Project Deliverables

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Talks and Presentations at Workshops and Conferences

 
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Progress of Advanced Packaging   TUD, Boschman, Nexperia IEEE EPS Seminar at TU Delft 24.11.2023  

Nexperia guest lecture Dr. R. Poelma Nexperia, TUD TUD ET4391 Advanced microelectronics packaging Q3 2023 Visit