Dissemination
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| Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior | Mike Feuchter; Hanna Baumgartl; Martin Hanke; Sven Rzepka; Bernhard Wunderle | CADFEM Germany GmbH, Fraunhofer ENAS, Technische Universität Chemnitz | 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE | 09 April 2024 | Link to Paper |
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Title |
Author |
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Source |
Date |
Resource |
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| Progress of Advanced Packaging | TUD, Boschman, Nexperia | IEEE EPS Seminar at TU Delft | 24.11.2023 | ||
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| Nexperia guest lecture | Dr. R. Poelma | Nexperia, TUD | TUD ET4391 Advanced microelectronics packaging | Q3 2023 | Visit |
