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Title |
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Project Partners Involved
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| Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior | M. Feuchter, H. Baumgartl, M. Hanke, S. Rzepka, B. Wunderle | CADFEM Germany GmbH, Fraunhofer ENAS, Technische Universität Chemnitz | 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024) | 09.04.2024 | Link to Paper |
| CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design | B. Erol, D. May, B. Wunderle | Technische Universität Chemnitz |
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2024) | 09.04.2024 | Link to Paper |
| Condition Assessment after Early Failures in Power Equipment despite successfully passed Factory Acceptance and Commissioning Tests | R. Ross, A.-J. de Graaf, P. Ypma, M. Ross | IWO Institute for Science & Development | Cigre 2024 | 26.08.2024 | Link to Paper |
| Numerical Investigation of a Novel Lid Design for Automotive HPC Cooling | B. Erol, D. May, B. Wunderle | Technische Universität Chemnitz |
30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2024) |
05.09.2024 | Link to Paper |
| Highly Efficient Modeling of Solder Balls and Their Visco-plastic Behaivor Applying the Energy Conserving Sampling and Weighting Method | M. Feuchter, H. Baumgartl, M. Hanke, S. Rzepka | CADFEM Germany GmbH, Fraunhofer ENAS | IEEE 10th Electronics System-Integration Technology Conference (ESTC 2024) | 11.09.2024 | Link to Paper |
| Diagnostics, Prognostics and Selection Methodologies for Uninterrupted Functionality of K-Out-Of-N Systems | R. Ross, A.-J. de Graaf | IWO Institute for Science & Development | 10th International Conference on Condition Monitoring and Diagnosis (CMD 2024) | 20.10.2024 | Link to Paper |
| Nonlinear Superelement for the Reliability Assessment of Visco-Plastic Solder Balls | M. Feuchter, H. Baumgartl, M. Hanke, S. Rzepka | CADFEM Germany GmbH, Fraunhofer ENAS | 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2025) | 06.04.2025 | Link to Paper |
| Accelerating Root Cause Identification of Subtle Bonding Failures Using Microwave Induced Plasma | Y. Peng, J. Tang | Jiaco Instruments B.V | IEEE 75th Electronics Components and Technology Conference (ECTC 2025) | 27.05.2025 | Link to Paper |
| Efficient Utilization of Different Kinds of Superelements for Thermo-Mechanical Reliability FE-Analysis of Chiplets | M. Feuchter, H. Baumgartl, M. Hanke | CADFEM Germany GmbH | IEEE 75th Electronics Components and Technology Conference (ECTC 2025) | 27.05.2025 | Link to Paper |
| Compact Models for Nonlinear Thermo-Mechanical Simulations of Chiplets in Automotive | M. Feuchter, H. Baumgartl, M. Hanke, B. Srivatsan, G. Gadhiya, P. Gromala, S. Rzepka | CADFEM Germany GmbH, Robert Bosch GmbH, Fraunhofer ENAS | IEEE 75th Electronics Components and Technology Conference (ECTC 2025) | 27.05.2025 | Link to Paper |
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| Progress of Advanced Packaging | TUD, Boschman, Nexperia | IEEE EPS Seminar at TU Delft | 24.11.2023 | ||
| Nexperia guest lecture | Dr. R. Poelma | Nexperia, TUD | TUD ET4391 Advanced microelectronics packaging | Q3 2023 and 2024 |
Visit |
| Heterogeneous Integration Roadmap | Dr. P. Gromala | Robert Bosch | IEEE EPS Seminar at ESTC 2024 | 11.09.2024 | Visit |
| Enabling EU Leadership in automotive ECU for future Autonomous Driving – Reliability Challenges | Dr. P. Gromala | Robert Bosch, Fraunhofer ENAS | 41st Chemnitz Seminar | 14.02.2025 | Visit |
| The Unique Role of Thermal Test Vehicles (TTV) for TIM Characterization and Reliability investigation | Dr. M. Abo Ras | Berliner Nanotest und Design GmbH, Fraunhofer ENAS | 41st Chemnitz Seminar | 14.02.2025 | Visit |
