News

Discover dissemination and further public activities related to e²LEAD.
Read about the project in the categories: Project Event, Conference, Journal, Workshop, Webinar, External Publication.

2nd Year Review Meeting

04/24

2nd Year Review Meeting hosted by TU Delft

On April 3rd and 4th we met in Delft in the Netherlands for our second year review meeting. After the first two years we successfully developed the methods and components and are now ready to enter the integration and test phase of the project. It has been two years since we began our collaboration on Advanced Packaging for automotive electronics. Together with our partners — Audi, Cariad, CADFEM, Fraunhofer ENAS, ILFA, NanoTest, Nexperia, Boschman, Jiaco, IWO, TU Berlin, TU Chemnitz, TU Delft and Bosch — we are developing a supercomputing platform for future autonomous driving. Our work focuses on three key domains:

• Connectivity: Developing high-performance data interfaces and low-stress cooling solutions. 
• Technology: Innovating automotive chiplets and smart power stages. 
• Reliability/Safety: Creating new testing strategies and compact digital twins for coupled thermal and thermo-mechanical domains. 

On the second day after the 2nd year review has been finished, we sat together to discuss the upcoming challenges and held a workshop about virtual referencing. During the last two years, the partners came up with many new ideas for a demonstrator version with different chip sizes providing a more asymmetric and thus realistic design. Therefore, we applied for a half year project extension to implement a demonstrator version with an advanced design. Many of our partners stayed in the Netherlands over the following weekend to attend and present their work at the EuroSIMe conference in Utrecht in the subsequent week. The IEEE EPS chapter took this opportunity to also organize a seminar titled “Progress and Future of Heterogenous System Integration, Packaging, and Reliability” at TU Delft. Distinguished speakers from both, university and industry gave insights into the current and upcoming challenges in chiplet packaging and heterogenous integration.

This research is made possible through funding from BMBF Germany, Rijksdienst voor Ondernemend Nederland, and the European Union via Xecs (part of the Eureka Cluster).

Project Meeting

10/24

Project Alignment Meeting July 2024 in Chemnitz

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

On October 28th and 29th, our team gathered in Chemnitz to review the progress of our ongoing project, tackle any challenges, and define our next steps. This meeting centered on three key topics:

Collaboration with the BMBF MikroVAL Project

We had a valuable exchange with the team from the BMBF project MikroVAL, focused on Model Order Reduction and Digital Twin technologies. Since both projects use similar methodologies, this exchange allowed us to share insights, identify areas of potential collaboration, and explore ways to leverage each other's progress. We aim to meet again next year to compare advancements and reinforce our cooperation.

IEEE EPS Lecture by John Lau on Chiplet Design

Thanks to an invitation from IEEE EPS and with the hosting of TU Chemnitz, participants from both e²LEAD and MikroVAL projects, TU Chemnitz students, scientists from FhG and TU Chemnitz and others attended a distinguished lecture by IEEE EPS’s John Lau. In this hybrid event, with over 150 attendees joining in person and online, John Lau shared his expertise on “Chiplet Design and Heterogeneous Integration Packaging.” Our appreciation goes to IEEE EPS and TU Chemnitz for facilitating this enlightening session! Project

Updates and Action Planning

After these insightful sessions, the e²LEAD team members presented updates on their respective tasks and collaborated to plan the next steps. We wrapped up the meeting with a clear roadmap and designated responsibilities for upcoming milestones, focusing on finalizing our demonstrator.

Link to Post

Project Meeting

07/24

Project Alignment Meeting in Berlin July 2024

 

Partners of the e²LEAD project work collaboratively on the advanced packaging to enable supercomputing platforms for highly automated driving. On July 1st and 2nd we meet in Berlin at Fraunhofer Forum to discuss the progress of the current project, address any issues or roadblocks, and make decisions on next steps. The team members provided updates on their tasks and shared their insights on potential challenges and opportunities. During the meeting NANOTEST made a demo presentation of the Thermal Test Chip that we are using in the project. The meeting concluded with a clear plan of action and assigned responsibilities for the upcoming tasks. Our goal for this year is to prepare demonstrator. This project is funded by Germany and the Netherlands. Thanks to all partners for the contribution!

EuroSimE 2024

04/24

Mike Feuchter received Outstanding Paper Award

 

The complexity of automotive and industrial electronic control units does not allow the use of regular finite element analyses for the complete design optimization with respect to thermomechanical reliability. Therefore, a novel approach is proposed that massively reduces the computational effort without compromising the result accuracy. It is based on a modular system of reduced-order models. In this paper, projection-based methods for capturing the complex material behaviour of solder balls are introduced as key enabler for this approach. It is shown that the discrete empirical interpolation method can reduce the number of degrees of freedom massively to speed-up the simulations with a high accuracy.

Link to Post

Project Meeting

01/24

First e²LEAD Review Meeting in @ TU Berlin

e²LEAD sucessfully met for the first Xecs project review meeting on the 5th of March at the TU Berlin. Strengthened by the positive feedback from the reviewers, the consortium was able to devote the 6th of March to intensive discussions about the next steps of the project with regards to the upcominge demonstrator development.

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