e²LEAD
Enabling EU Leadership in automotive ECU for future Autonomous Driving
Supercomputing systems face tremendous challenges regarding the packaging technologies for communication and signal processing units, as well as heat removal and power delivery. This is particularly true for automotive supercomputer platforms designed for autonomous driving at Level 5, where high information interchange rates across multiple physical channels must lead to real-time driving decisions in the most trustworthy and reliable manner. e²LEAD focuses on advanced packaging to enable the development of supercomputing platforms 'Made in Europe' for the automotive industry, working across three research domains: Connectivity for high-performance data and thermal interfacing, Technology for automotive chiplet and smart power system (SPS) packaging and integration, and Reliability/Safety for new test strategies and digital twin-based design methods.
Project Facts
Project Lead
BOSCH
Countries
2
Partners
14
Costs
>9 Mio. €
Research Area
Transport and Smart Mobility
Duration
36 Months
Latest News
11/2025 e²LEAD - Project Meeting Ingolstadt
On November 17th and 18th the e2LEAD partners came together once again align on the upcoming tasks for testing and validation of the demonstrator. This time, Cariad and Audi hosted us at their state-of-the-art facilities in Ingolstadt. During the two-day meeting, we shared updates on the current project status and then split into focused working groups to coordinate the collaboration needed for the upcoming testing activities. Discussion also covered the implementation of the second demonstrator, which will feature an advanced chiplet.
After the productive sessions, we had the privilege of visiting Audi’s headquarters and production plant. Witnessing the entire process of building an Audi—from metal perforation to final assembly—was truly impressive and inspiring.
Partners
