e²LEAD
Enabling EU Leadership in automotive ECU for future Autonomous Driving
Supercomputing systems face tremendous challenges regarding the packaging technologies for communication and signal processing units, as well as heat removal and power delivery. This is particularly true for automotive supercomputer platforms designed for autonomous driving at Level 5, where high information interchange rates across multiple physical channels must lead to real-time driving decisions in the most trustworthy and reliable manner. e²LEAD focuses on advanced packaging to enable the development of supercomputing platforms 'Made in Europe' for the automotive industry, working across three research domains: Connectivity for high-performance data and thermal interfacing, Technology for automotive chiplet and smart power system (SPS) packaging and integration, and Reliability/Safety for new test strategies and digital twin-based design methods.
Project Facts
Project Lead
BOSCH
Countries
2
Partners
14
Costs
>9 Mio. €
Research Area
Transport and Smart Mobility
Duration
36 Months
Latest News
04/2024 Mike Feuchter received Outstanding Paper Award during EuroSimE Conference 2024 in Catania
Reduced-Order Model for Solder Balls – Potential of projection-based approaches for representing viscoplastic behavior
The complexity of automotive and industrial electronic control units does not allow the use of regular finite element analyses for the complete design optimization with respect to thermomechanical reliability. Therefore, a novel approach is proposed that massively reduces the computational effort without compromising the result accuracy. It is based on a modular system of reduced-order models. In this paper, projection-based methods for capturing the complex material behaviour of solder balls are introduced as key enabler for this approach. It is shown that the discrete empirical interpolation method can reduce the number of degrees of freedom massively to speed-up the simulations with a high accuracy.
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