e²LEAD

Enabling EU Leadership in automotive ECU for future Autonomous Driving

Supercomputing systems face tremendous challenges regarding the packaging technologies for communication and signal processing units, as well as heat removal and power delivery. This is particularly true for automotive supercomputer platforms designed for autonomous driving at Level 5, where high information interchange rates across multiple physical channels must lead to real-time driving decisions in the most trustworthy and reliable manner. e²LEAD focuses on advanced packaging to enable the development of supercomputing platforms 'Made in Europe' for the automotive industry, working across three research domains: Connectivity for high-performance data and thermal interfacing, Technology for automotive chiplet and smart power system (SPS) packaging and integration, and Reliability/Safety for new test strategies and digital twin-based design methods.

Project Facts

Project Lead
BOSCH

Countries

Partners

Costs

>9 Mio. €

Research Area

Transport and Smart Mobility

Duration

36 Months

Latest News

10/2024 e²LEAD - Enabling EU Leadership in automotive ECU for future Autonomous Driving – project progress review.

October 28th and 29th, our team gathered in Chemnitz to review the progress of our ongoing project, tackle any challenges, and define our next steps. This meeting centered on three key topics:

Collaboration with the BMBF MikroVAL Project

We engaged in a productive exchange with the BMBF MikroVAL team, centered on Model Order Reduction and Digital Twin technologies. Sharing methodologies enabled us to identify collaboration opportunities and ways to build on each other’s progress. We plan to meet again next year to review advancements and strengthen our cooperation.

IEEE EPS Lecture by John Lau on Chiplet Design

Invited by IEEE EPS and hosted by TU Chemnitz, over 150 participants from e²LEAD, MikroVAL, TU Chemnitz, and FhG attended a lecture by John Lau on “Chiplet Design and Heterogeneous Integration Packaging.” We thank IEEE EPS and TU Chemnitz for organizing this valuable session.

Project Updates and Action Planning

Following these sessions, the e²LEAD team presented task updates and outlined next steps. The meeting concluded with a clear roadmap, assigned responsibilities, and a focus on finalizing our demonstrator.

Thanks to all partners for the contribution!

07/2024 e²LEAD - Enabling EU Leadership in automotive ECU for future Autonomous Driving – alignment meeting.

Partners of the e²LEAD project work collaboratively on the advanced packaging to enable supercomputing platforms for highly automated driving. On July 1st and 2nd we meet in Berlin at Fraunhofer Forum to discuss the progress of the current project, address any issues or roadblocks, and make decisions on next steps. The team members provided updates on their tasks and shared their insights on potential challenges and opportunities. During the meeting NANOTEST made a demo presentation of the Thermal Test Chip that we are using in the project. The meeting concluded with a clear plan of action and assigned responsibilities for the upcoming tasks. Our goal for this year is to prepare demonstrator. This project is funded by Germany and the Netherlands.

Thanks to all partners for the contribution!